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1. product profile 1.1 general description planar passivated sensitive gate four quadrant triac in a sot223 (sc-73) surface-mountable plastic package intended for applications requiring enhanced immunity to noise and direct interfacing to logic level ics and low power gate drivers. 1.2 features and benefits ? direct interfacing to logic level ics ? enhanced current surge capability ? enhanced noise immunity ? high blocking voltage capability ? sensitive gate trig gering in all four quadrants ? surface-mountable package 1.3 applications ? general purpose low power motor control ? home appliances ? industrial process control ? low power ac fan controllers 1.4 quick reference data Z0103MN0 4q triac rev. 01 3 january 2011 product data sheet sot223 table 1. quick reference data symbol parameter conditions min typ max unit v drm repetitive peak off-state voltage --600v i tsm non-repetitive peak on-state current full sine wave; t j(init) =25c; t p = 20 ms; see figure 4 ; see figure 5 --12.5a i t(rms) rms on-state current full sine wave; t sp 103 c; see figure 3 ; see figure 1 ; see figure 2 --1a
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 2 of 15 nxp semiconductors Z0103MN0 4q triac 2. pinning information 3. ordering information 4. marking [1] % = placeholder for manufacturing site code static characteristics i gt gate trigger current v d =12v; i t = 0.1 a; t2+ g+; t j =25c; see figure 9 0.2 - 3 ma v d =12v; i t = 0.1 a; t2+ g-; t j =25c; see figure 9 0.2 - 3 ma v d =12v; i t = 0.1 a; t2- g-; t j =25c; see figure 9 0.2 - 3 ma v d =12v; i t = 0.1 a; t2- g+; t j =25c; see figure 9 0.2 - 5 ma table 1. quick reference data ?continued symbol parameter conditions min typ max unit table 2. pinning information pin symbol description simplified outline graphic symbol 1 t1 main terminal 1 sot223 (sot223) 2 t2 main terminal 2 3 g gate 4 t2 main terminal 2 13 2 4 sym051 t1 g t2 table 3. ordering information type n umber package name description version Z0103MN0 sot223 plastic surface-mounted package with increased heatsink; 4 leads sot223 table 4. marking codes type n umber marking code [1] Z0103MN0 103mn0
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 3 of 15 nxp semiconductors Z0103MN0 4q triac 5. limiting values table 5. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v drm repetitive peak off-state voltage - 600 v i t(rms) rms on-state current full sine wave; t sp 103 c; see figure 3 ; see figure 1 ; see figure 2 -1a i tsm non-repetitive peak on-state current full sine wave; t j(init) =25c; t p = 20 ms; see figure 4 ; see figure 5 - 12.5 a full sine wave; t j(init) =25c; t p =16.7ms - 13.8 a i 2 t i 2 t for fusing t p = 10 ms; sin - 0.78 a 2 s di t /dt rate of rise of on-state current i t =1a; i g =20ma; di g /dt = 100 ma/s; t2+ g+ -50a/s i t =1a; i g =20ma; di g /dt = 100 ma/s; t2+ g- -50a/s i t =1a; i g =20ma; di g /dt = 100 ma/s; t2- g- -50a/s i t =1a; i g =20ma; di g /dt = 100 ma/s; t2- g+ -20a/s i gm peak gate current - 1 a p gm peak gate power - 2 w p g(av) average gate power over any 20 ms period - 0.1 w t stg storage temperature -40 150 c t j junction temperature - 125 c fig 1. rms on-state current as a function of surge duration; maximum values fig 2. rms on-state current as a function of solder point temperature; maximum values 003aac269 0 2 4 6 8 10 -2 10 -1 1 10 surge duration (s) i t(rms) (a) 003aac270 0 0.4 0.8 1.2 -50 0 50 100 150 t sp ( c) i t(rms) (a)
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 4 of 15 nxp semiconductors Z0103MN0 4q triac fig 3. total power dissipation as a function of rms on-state cu rrent; maximum values fig 4. non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aac259 0.0 0.4 0.8 1.2 1.6 2.0 0 0.2 0.4 0.6 0.8 1 1.2 i t(rms) (a) p tot (w) = 180 120 90 60 30 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 003aaf449 8 4 12 16 i tsm (a) 0 number of cycles 1 10 3 10 2 10 i tsm t i t t j(init) = 25 c max 1/f
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 5 of 15 nxp semiconductors Z0103MN0 4q triac 6. thermal characteristics fig 5. non-repetitive peak on-state current as a function of pulse width; maximum values 003aaf490 1 10 10 2 10 3 10 ?5 10 ?4 10 ?3 10 ?2 10 ?1 t p (s) i tsm (a) (2) (1) i tsm t i t t j(init) = 25 c max t p table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-sp) thermal resistance from junction to solder point full cycle; see figure 8 --15k/w r th(j-a) thermal resistance from junction to ambient in free air; printed-circuit board mounted: minimum footprint; full cycle; see figure 6 - 156 - k/w in free air; printed-circuit board mounted: pad area; full cycle; see figure 7 -70-k/w
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 6 of 15 nxp semiconductors Z0103MN0 4q triac all dimensions are in mm all dimensions are in mm printed-circuit board: fr4 epoxy glass (1.6 mm thick), copper laminate (35 um thick) fig 6. minimum footprint sot223 fig 7. printed-circuit board pad area sot223 fig 8. transient thermal impedance from junction to solder point as a function of pulse width 001aab508 3.8 min 1.5 min 1.5 min (3) 2.3 4.6 6.3 1.5 min 001aab509 7 4.6 15 36 9 10 18 4.5 60 50 003aac210 10 -2 10 -1 1 10 10 2 10 -5 10 -4 10 -3 10 -2 1 10 t p (s) z th(j-sp) (k/w) t p p t 10 -1
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 7 of 15 nxp semiconductors Z0103MN0 4q triac 7. characteristics table 7. characteristics symbol parameter conditions min typ max unit static characteristics i gt gate trigger current v d =12v; i t = 0.1 a; t2+ g+; t j =25c; see figure 9 0.2 - 3 ma v d =12v; i t = 0.1 a; t2+ g-; t j =25c; see figure 9 0.2 - 3 ma v d =12v; i t = 0.1 a; t2- g-; t j =25c; see figure 9 0.2 - 3 ma v d =12v; i t = 0.1 a; t2- g+; t j =25c; see figure 9 0.2 - 5 ma i l latching current v d =12v; i g = 0.1 a; t2+ g+; t j =25c; see figure 10 --7ma v d =12v; i g = 0.1 a; t2+ g-; t j =25c; see figure 10 --20ma v d =12v; i g = 0.1 a; t2- g-; t j =25c; see figure 10 --7ma v d =12v; i g = 0.1 a; t2- g+; t j =25c; see figure 10 --7ma i h holding current v d =12v; t j =25c; see figure 14 --7ma v t on-state voltage i t =1a; t j = 25 c; see figure 11 -1.31.6v v gt gate trigger voltage v d =12v; i t = 0.1 a; t j =25c; see figure 12 --1.3v v d =600v; i t = 0.1 a; t j =125c 0.2--v i d off-state current v d =600v; t j = 125 c - - 0.5 ma dynamic characteristics dv d /dt rate of rise of off-state voltage v dm =402v; t j = 110 c; gate open circuit; exponential waveform; see figure 13 80--v/s dv com /dt rate of change of commutating voltage v d =400v; t j =110c; di com /dt = 0.44 a/ms; gate open circuit 0.5--v/s
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 8 of 15 nxp semiconductors Z0103MN0 4q triac (1) t2- g+ (2) t2- g- (3) t2+ g- (4) t2+ g+ fig 9. normalized gate trigger current as a function of junction temperature fig 10. normalized latching current as a function of junction temperature v o = 1.254 v r s = 0.31 ? (1) t j = 125 c; typical values (2) t j = 125 c; maximum values (3) t j = 25 c; maximum values fig 11. on-state current as a function of on-state voltage fig 12. normalized gate trigger voltage as a function of junction temperature t j (c) ?50 150 100 0 50 003aaa205 2 1 3 4 0 i gt(25c) i gt (1) (2) (3) (4) t j (c) ?50 150 100 0 50 003aaa203 1 2 3 0 i l i l(25c) 003aac258 0 0.4 0.8 1.2 1.6 2 0 0.4 0.8 1.2 1.6 2 v t (v) i t (a) (1) (2) (3) t j (c) ?50 150 100 0 50 003aaa209 0.8 0.4 1.2 1.6 0 v gt(25c) v gt
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 9 of 15 nxp semiconductors Z0103MN0 4q triac fig 13. normalized critical rate of rise of off-state voltage as a function of junction temperature; typical values fig 14. normalized holding current as a function of junction temperature 1.6 1.2 0.8 0.4 0 a 0 50 100 150 t j (c) 003aaa208 t j (c) ?50 150 100 0 50 003aaa204 1 2 3 0 i h(25c) i h
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 10 of 15 nxp semiconductors Z0103MN0 4q triac 8. package outline fig 15. package outline sot223 (sot223) unit a 1 b p cd e e 1 h e l p qy wv references outline version european projection issue date iec jedec jeita mm 0.10 0.01 1.8 1.5 0.80 0.60 b 1 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 2.3 e 4.6 7.3 6.7 1.1 0.7 0.95 0.85 0.1 0.1 0.2 dimensions (mm are the original dimensions) sot223 sc-73 04-11-10 06-03-16 w m b p d b 1 e 1 e a a 1 l p q detail x h e e v m a a b b c y 0 2 4 mm scale a x 13 2 4 plastic surface-mounted package with increased heatsink; 4 leads sot223
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 11 of 15 nxp semiconductors Z0103MN0 4q triac 9. soldering fig 16. reflow soldering footprint for sot223 (sot223) fig 17. wave soldering footprint for sot223 (sot223) sot223_fr 1.2 (4) 1.2 (3) 1.3 (4) 1.3 (3) 6.15 7 3.85 3.6 3.5 0.3 3.9 7.65 2.3 2.3 6.1 4 23 1 solder lands solder resist occupied area solder paste dimensions in mm sot223_fw 1.9 6.7 8.9 8.7 1.9 (3) 1.9 (2) 1.1 6.2 2.7 2.7 2 4 3 1 solder lands solder resist occupied area preferred transport direction during soldering dimensions in mm
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 12 of 15 nxp semiconductors Z0103MN0 4q triac 10. revision history table 8. revision history document id release date data sheet status change notice supersedes Z0103MN0 v.1 20110103 product data sheet - -
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 13 of 15 nxp semiconductors Z0103MN0 4q triac 11. legal information 11.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple de vices. the latest product status information is available on the internet at url http://www.nxp.com . 11.2 definitions draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 11.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objective specification for product development. preliminary [short] data sheet qualific ation this document contains data from the preliminary specification. product [short] data sheet production this doc ument contains the product specification.
Z0103MN0 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 01 3 january 2011 14 of 15 nxp semiconductors Z0103MN0 4q triac agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulati ons. export might require a prior authorization from national authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 11.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey , greenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode ? are trademarks of nxp b.v. hd radio and hd radio logo ? are trademarks of ibiquity digital corporation. 12. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors Z0103MN0 4q triac ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 january 2011 document identifier: Z0103MN0 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 13. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 general description . . . . . . . . . . . . . . . . . . . . . .1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 6 thermal characteristics . . . . . . . . . . . . . . . . . . .5 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .7 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 9 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . .12 11 legal information. . . . . . . . . . . . . . . . . . . . . . . .13 11.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . .13 11.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 11.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 11.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14 12 contact information. . . . . . . . . . . . . . . . . . . . . .14

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